Mobile World Congress 2014 Wrapup
Did you miss Mobile World Congress this year? Or, if you were there, were you too busy to keep tabs on all the big announcements? Here is a selection of M2M news highlights from the big event last week in Barcelona.
Two key players in the space, Jasper Wireless, www.jasperwireless.com, and Telit Wireless Solutions, www.telit.com, announced they are partnering to deliver m2mAIR module-management services through the Jasper platform to applications using m2mAIR-ready Telit modules. Jasper, an M2M and IoT (Internet of Things) platform and service provider, hopes the joint effort will offer m2mAIR users more tools to manage and control their M2M applications. Telit Wireless Solutions, a provider of M2M and IoT products, services, and solutions, says leveraging Jasper’s platform will give m2mAIR customers a better experience with more insight into their modules.
Another M2M service and solution provider, Axeda, www.axeda.com, announced new Axeda-ready devices from several partner companies, including Atrack, CalAmp, Freescale Semiconductor, Huawei, Inventek Systems, Moog Crossbow, Multi-Tech, and u-blox. The company says partners and customers are better positioned to drive IoT initiatives by leveraging Axeda’s technology as part of the Axeda Ready Program. The program helps customers select the best communication devices for their planned deployments, also providing a testing and implementation program that helps remove obstacles to new deployments.
Also paving the way for new M2M solutions, Digi Intl., www.digi.com, announced its new Digi ConnectCore 6 module, which is designed to reduce costs and time to market for designs based on Freescale’s i.MX 6 series application processors. Digi, which offers wireless products and a cloud-computing platform, says ConnectCore 6 is the world’s first surface-mount multi-chip module with the built-in ability to connect via Wi-Fi, Bluetooth, Bluetooth Low Energy, and Device Cloud by Etherios. The company hopes the module will encourage innovation for M2M devices in many industries, making it faster and easier to design products and bring them to market.
Sierra Wireless, www.sierrawireless.com, also made several announcements around the time of MWC. First, it introduced Legato, a Linux-based platform for embedded application development. The open-source platform will make it simpler for M2M developers thanks to “pre-integrated and validated components that provide connectivity to any cloud, any network, and any peripheral.” Because the investment required to bring an M2M application through to completion is a big hurdle, Sierra hopes Legato will help by giving developers a “head start.”
Sierra Wireless has also signed an agreement with Tech Mahindra, www.techmahindra.com, a provider of connected solutions, to help provide turnkey M2M solutions for markets such as energy, transportation, and healthcare, among others. The two companies will collaborate by providing customers with Sierra’s AirPrime or AirLink technologies and AirVantage M2M Cloud capabilities along with consulting and solution-integration services from Tech Mahindra.
Yet another provider of IoT connectivity solutions, Lantronix, www.lantronix.com, recently demonstrated firmware that will help customers more fully benefit from the data their M2M products capture. Lantronix says it will leverage Google Analytics in two of its product families: PremierWave and xSenso. With the ability to deliver more robust reporting and analytics in realtime, Lantronix believes it is helping to drive the next wave of M2M adoption.
Dozens of new products were launched at Mobile World Congress. Among them was an advanced edge router, the CradlePoint AER 2100, from CradlePoint, www.CradlePoint.com. CradlePoint, a provider of cloud-managed 3G/4G networking solutions, says AER 2100 will support and scale to the networking needs of distributed enterprises at branch locations. Thanks to several key functions, the router will help enterprises leverage existing networking capabilities, then expand as operators increase 4G coverage.
Samsung, www.samsung.com, also made its presence known in Geneva by unveiling several new products for use in connected devices such as smartphones and tablets. The company released two Exynos application processors designed to optimize performance and device efficiency. Samsung also announced two CMOS (complementary metal–oxide semiconductor) image sensors with new ISOCELL technology, an NFC chip solution, and a Wi-Fi chipset that offers flexibility, high performance, and a small footprint.
As innovation and new technological advances abound, the future continues to look bright for M2M and IoT. If Mobile World Congress 2014 is any indicator of how the year will play out, the market is in for tremendous growth and forward progress.
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