Telit Debuts Products


Embedding cellular connectivity into devices is part of many M2M (machine-to-machine) solutions. Today, adopters have more options that ever when it comes to modules, software, and services that can help them get an M2M product off the ground. 

One M2M provider, Telit Wireless Solutions,, recently announced a number of new offerings designed to better enable cellular connectivity. For instance, Telit says it has formed an alliance with another M2M provider, Multi-Tech Systems,, to develop end devices that include Telit modules. The devices include items such as cellular routers and modems.

Telit says when embedding a cellular module into a device is not an option, it’s helpful to have an external solution, which the alliance with Multi-Tech will provide. Multi-Tech will use Telit’s HE910-D penta-band HSPA+ modules and its DE910-DUAL EV-DO CDMA modules.

When choosing a cellular module, it can sometimes be beneficial to opt for modules precertified on a carrier’s network. Depending on the specific application, a precertified module can speed up time-to-market. Telit also announced its family of HE910 3G and 4G modules received AT&T certification for use on the carrier’s HSPA and HSPA+ wireless network. These modules feature a low profile and low power consumption, and the company says they are useful for high-bandwidth mobile computing applications.

Telit also introduced the DE910-DUAL Mini PCIe (peripheral component interconnect express). The mini PCIe format can be used to integrate wireless connectivity into connected devices. Telit’s DE910-DUAL Mini PCIe is designed to serve commercial and industrial computer markets, and devices such as mobile computers, MRM (mobile resource management) terminals, digital signage, and point-of-sale devices, says Telit.

For the Asian, European, and Latin American markets, Telit introduced the GL865-DUAL V3 module, banded for GSM/GPRS cellular markets. The product is designed to minimize power consumption, which Telit says makes it useful for battery powered and wearable device applications.

More options for creating M2M solutions should make it easier for manufacturers and developers to find the connectivity option that works for them.

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June/July 2014
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